Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography
نویسندگان
چکیده
منابع مشابه
Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defect...
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ژورنال
عنوان ژورنال: Sensors
سال: 2015
ISSN: 1424-8220
DOI: 10.3390/s151025882